OEM stamping SMD lead frame with Ag spot plating

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$0.50 - $0.70 / Pieces | 1000 Piece/Pieces (Min. Order)
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Overview
Quick Details
Place of Origin:
Guangdong, China
Brand Name:
Vantech
Model Number:
VAN-20130903
Technology:
etching or stamping
Plating 1:
Mechanical mask Ag plating
Plating 2:
Photoresist Ag plating
Plating 3:
PPF /uPPF Plating
device:
down-set capacity
material:
cooper
Supply Ability
Supply Ability:
5000 Piece/Pieces per Week
Packaging & Delivery
Packaging Details
vacuum packing
Port
SHENZHEN
Lead Time :
15DAYS

Lead frame /   IC LEAD FRAME

 

copper lead frame:

 1.technology:photochemical etching/stamping

 2.material thickness:0.03 up to 1mm

 3.material:C194

 

A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.
Mitsui High-tec accomplished the production of IC leadframes by precision-die-stamping for the first time in the world and, at present, we are producing leadframes not only by stamping but also by chemical etching.
We supply a wide range of products such as fine pitch leadframes for ultra-multi-pin QFP, deep bent leadframes for P-VQFN/SON, in-die interlocked leadframes for power packaging and electronic parts backed up by our strong-point, that is, a hybrid of ultra-precision technology base and die-manufacturing technology.